Technology Roadmap
The information below details some of the key capabilities that Starteam can offer and support. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.
However if you have some specific requirements that are not shown in the table below, please feel free to contact us for a consultation. In the past our engineers have designed customized solutions for our customers' needs.
Click here to see our patents for specific technologies and solutions.
| Category | Details | 2020 | 2021 |
|---|---|---|---|
| Rigid | Layer Counts | up to 8 | up to 10 |
| Line Width/ Space Inner Layer | 100/100µm | 75/75µm | |
| Line Width/ Space Outer Layer | 100/100µm | 75/75µm | |
| Board thickness Min/Max-D/S | 0.5/3.2mm | 0.5/3.2mm | |
| Board thickness Min/Max- M/L | 0.5/3.2mm | 0.5/3.2mm | |
| Copper thickness | Inner Layer | 204 µm | 204 µm |
| Outer Layer | 204 µm | 204 µm | |
| Features | Impedance tolerance | ≥50Ω：±10% ，＜50Ω：±5Ω | ≥50Ω：±10% ，＜50Ω：±5Ω |
| Carbon print | Yes | Yes | |
| Depth Routing | (min.) Depth routing final remaining thickness: 0.2mm | (min.) Depth routing final remaining thickness: 0.2mm Process control tolerance: +/-0.075mm | |
| Semi-Flex PCB (bendable) | Yes | Yes | |
| Thermal management | Alu. substrate | Yes (1 Layer) (1W/3W/5W) | Yes (1 Layer) (1W/3W/5W) |
| Delivery panel size | Max | 490 X 590mm | 490 X 590mm |
| Min | Depends on customers’ requirements | Depends on customers’ requirements | |
| Drilling | Min Drill bit | ≤2Oz：0.2mm / ≥3Oz：0.3mm | ≤2Oz：0.2mm / ≥3Oz：0.3mm |
| Laser drilling | No | No | |
| Aspect ratio - through hole | 8 : 1 | 12: 1 | |
| Planned technology | HDI | No | No |
| Flex | No | No | |
| Rigid-Flex | No | No | |
| Laser routing only for Aluminum | Yes | Yes | |
| LDI for solder mask | No | Yes |
Metal Substrate Capability
| Properties | Capability |
|---|---|
| Max layer count | 1 |
| Metal material | Ventec, Boyu, AJU, etc |
| Copper thickness range | 17-102µm |
| Dielectric thickness range | 50-250µm |
| Thermal conductivity range | 1.0~5w/m.K |
| Min. line width/spacing with 1oz | 100/100µm |
| Solder mask color | White, Black, Green etc |
| Surface Finish | OSP, ENIG, Immersion Tin, HAL LF |
| High-pot test | Yes |
| The Max voltage value (VDC or VAC) | AC and DC 10KV |
Surface Finishes
Surface Finishes | Thickness | In Accordance With |
|---|---|---|
OSP | 0.2µm (min.) | IPC-J-STD-003 |
ENIG | Ni: 3um (min.) Au: 0.05µm (min.) | IPC-4552 |
HAL LF | Thickness 1-40µm | IPC-J-STD-003 |
Immersion Tin | Thickness min 1µm | IPC-4554 |
